CVE-2017-18157

moderate-risk
Published 2019-05-06

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Do I need to act?

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0.09% chance of exploitation
EPSS score — low exploit probability
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Not on CISA KEV list
No confirmed active exploitation reported to CISA
?
Patch status unknown
Check vendor advisories for fix availability and mitigation guidance
7
CVSS 7.8/10 High
LOCAL / LOW complexity

Affected Products (20)

Affected Vendors

Qualcomm

References (2)

Vendor Advisory https://www.qualcomm.com/company/product-security/bulletins
Vendor Advisory https://www.qualcomm.com/company/product-security/bulletins
44
/ 100
moderate-risk
Severity 24/34 · High
Exploitability 0/34 · Minimal
Exposure 20/34 · Moderate