CVE-2018-11277
moderate-risk
Published 2018-09-20
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Do I need to act?
-
0.04% chance of exploitation
EPSS score — low exploit probability
-
Not on CISA KEV list
No confirmed active exploitation reported to CISA
?
Patch status unknown
Check vendor advisories for fix availability and mitigation guidance
7
CVSS 7.8/10
High
LOCAL
/ LOW complexity
Affected Products (20)
Sd212 Firmware
Sd430 Firmware
Sd615 Firmware
Sd616 Firmware
Sd415 Firmware
Sd617 Firmware
Sd650 Firmware
Sd652 Firmware
Sd810 Firmware
Sd820A Firmware
Affected Vendors
References (2)
Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins
Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins
44
/ 100
moderate-risk
Severity
24/34 · High
Exploitability
0/34 · Minimal
Exposure
20/34 · Moderate