CVE-2019-14037
moderate-risk
Published 2020-07-30
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
Do I need to act?
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0.04% chance of exploitation
EPSS score — low exploit probability
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Not on CISA KEV list
No confirmed active exploitation reported to CISA
?
Patch status unknown
Check vendor advisories for fix availability and mitigation guidance
7
CVSS 7.8/10
High
LOCAL
/ LOW complexity
Affected Products (20)
Affected Vendors
47
/ 100
moderate-risk
Severity
24/34 · High
Exploitability
0/34 · Minimal
Exposure
23/34 · High